[Scientific Journal Cover design] Nanoscale Dewetting: Nanoscale-Dewetting-Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing (Adv. Mater. 21/2020)

Scientific Journal Cover design

Tae-il Kim and his team have developed an innovative method for creating electrical interconnections in flexible electronics through selective dewetting of a polymer adhesive. This process is particularly effective for assembling microelectronics with precision. By controlling the dewetting of the polymeric adhesive on specific electrode regions, vertical interconnections of the microelectronics are formed. The team successfully demonstrated this technique with thousands of micro LEDs, each measuring 30 μm × 60 μm. This method shows great promise for advancing flexible electronic devices.-Scientific Journal cover design by scapiens

https://onlinelibrary.wiley.com/doi/10.1002/adma.202070161

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