Tae-il Kim and his team have developed a flexible and stretchable heat sink embedded with boron nitride nanosheets and tetrahedral interlayer structures. This innovative composite material demonstrates high thermal conductivity in both through- and in-plane directions, even with a low fraction of boron nitride. This makes it particularly useful for deformable electronics.-Scientific Journal cover design by scapiens.

https://onlinelibrary.wiley.com/doi/abs/10.1002/adfm.201970252