The development of three-dimensional (3D) interconnections is crucial in the packaging technology of integrated circuits. Traditional interconnection methods like wire bonding are unsuitable for integrating soft and stretchable electronic devices. This necessitates the creation of 3D interconnection technology tailored for flexible electronics. We present a novel material and process for creating high-resolution, stretchable 3D interconnections on flexible devices and substrates. This involves liquid-metal-based composites enhanced with Pt-decorated carbon nanotubes, which improve the mechanical strength of the liquid metal matrix. These composites can be 3D printed in various dimensions, with minimum diameters around 5 μm, and possess a breakdown current density comparable to that of metal wires. -Scientific Journal cover design by scapiens.
[Scientific Journal cover design] Low-Thermal-Budget Fluorite-Structure Ferroelectrics for Future Electronic Device Applications
In article number 2100028, Jiyoung Kim, Si Joon Kim, and their team review key factors involved in developing fluorite-structure ferroelectrics
